Part Number : | APF19-19-06CB |
---|---|
Manufacturer/Brand : | CTS Electronic Components |
Description : | HEATSINK LOW-PROFILE FORGED |
RoHs Status : | Lead free / RoHS Compliant |
Quantity Available | 10334 pcs |
Datasheets | 1.APF19-19-06CB.pdf2.APF19-19-06CB.pdf |
Width | 0.748" (19.00mm) |
Type | Top Mount |
Thermal Resistance @ Natural | - |
Thermal Resistance @ Forced Air Flow | 7.10°C/W @ 200 LFM |
Shape | Square, Fins |
Series | APF |
Power Dissipation @ Temperature Rise | - |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Other Names | 294-1145 APF191906CB |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material Finish | Black Anodized |
Material | Aluminum |
Manufacturer Standard Lead Time | 14 Weeks |
Length | 0.748" (19.00mm) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Height Off Base (Height of Fin) | 0.250" (6.35mm) |
Diameter | - |
Detailed Description | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount |
Attachment Method | Thermal Tape, Adhesive (Not Included) |