Part Number : | EPC2010C |
---|---|
Manufacturer/Brand : | EPC |
Description : | TRANS GAN 200V 22A BUMPED DIE |
RoHs Status : | Lead free / RoHS Compliant |
Quantity Available | 7236 pcs |
Datasheets | EPC2010C.pdf |
Vgs(th) (Max) @ Id | 2.5V @ 3mA |
Vgs (Max) | +6V, -4V |
Technology | GaNFET (Gallium Nitride) |
Supplier Device Package | Die Outline (7-Solder Bar) |
Series | eGaN® |
Rds On (Max) @ Id, Vgs | 25 mOhm @ 12A, 5V |
Power Dissipation (Max) | - |
Packaging | Tape & Reel (TR) |
Package / Case | Die |
Other Names | 917-1085-2 |
Operating Temperature | -40°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Manufacturer Standard Lead Time | 12 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Input Capacitance (Ciss) (Max) @ Vds | 540pF @ 100V |
Gate Charge (Qg) (Max) @ Vgs | 5.3nC @ 5V |
FET Type | N-Channel |
FET Feature | - |
Drive Voltage (Max Rds On, Min Rds On) | 5V |
Drain to Source Voltage (Vdss) | 200V |
Detailed Description | N-Channel 200V 22A (Ta) Surface Mount Die Outline (7-Solder Bar) |
Current - Continuous Drain (Id) @ 25°C | 22A (Ta) |