Part Number : | HF115AC-0.0055-AC-105 |
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Manufacturer/Brand : | Bergquist |
Description : | THERM PAD 36.83MMX21.29MM W/ADH |
RoHs Status : | Lead free / RoHS Compliant |
Quantity Available | 564778 pcs |
Datasheets | HF115AC-0.0055-AC-105.pdf |
Usage | SIP |
Type | Pad, Sheet |
Thickness | 0.0055" (0.140mm) |
Thermal Resistivity | 0.35°C/W |
Thermal Conductivity | 0.8 W/m-K |
Shape | Rectangular |
Series | Hi-Flow® 115-AC |
Outline | 36.83mm x 21.29mm |
Other Names | BER170 HF115AC-105 HF115AC00055AC105 HF115TAAC-105 |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Material | Phase Change Compound |
Manufacturer Standard Lead Time | 2 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Detailed Description | Thermal Pad Gray 36.83mm x 21.29mm Rectangular Adhesive - One Side |
Color | Gray |
Backing, Carrier | Fiberglass |
Adhesive | Adhesive - One Side |