| Part Number : | XCZU17EG-3FFVC1760E |
|---|---|
| Manufacturer/Brand : | Xilinx |
| Description : | IC FPGA 512 I/O 1760FCBGA |
| RoHs Status : | Lead free / RoHS Compliant |
| Quantity Available | 4 pcs |
| Datasheets | XCZU17EG-3FFVC1760E.pdf |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| Speed | 600MHz, 667MHz, 1.5GHz |
| Series | Zynq® UltraScale+™ MPSoC EG |
| RAM Size | 256KB |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
| Peripherals | DMA, WDT |
| Packaging | Tray |
| Package / Case | 1760-BBGA, FCBGA |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Number of I/O | 512 |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Manufacturer Standard Lead Time | 20 Weeks |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| Flash Size | - |
| Detailed Description | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 926K+ Logic Cells 256KB 600MHz, 667MHz, 1.5GHz 1760-FCBGA (42.5x42.5) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
