Part Number : | TS391LT250 |
---|---|
Manufacturer/Brand : | Chip Quik, Inc. |
Description : | THERMALLY STABLE SOLDER PASTE NO |
RoHs Status : | Lead free / RoHS Compliant |
Quantity Available | 406 pcs |
Datasheets | TS391LT250.pdf |
Wire Gauge | - |
Type | Solder Paste |
Shipping Info | - |
Shelf Life Start | Date of Manufacture |
Shelf Life | 12 Months |
Series | - |
Process | Lead Free |
Moisture Sensitivity Level (MSL) | Not Applicable |
Melting Point | 281°F (138°C) |
Manufacturer Standard Lead Time | 3 Weeks |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Form | Jar, 8.8 oz (250g) |
Flux Type | No-Clean |
Diameter | - |
Detailed Description | Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g) |
Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |