Part Number : |
TS391SNL250 |
Manufacturer/Brand : |
Chip Quik, Inc. |
Description : |
THERMALLY STABLE SOLDER PASTE NO |
RoHs Status : |
Lead free / RoHS Compliant |
Quantity Available |
461 pcs |
Datasheets |
TS391SNL250.pdf |
Wire Gauge |
- |
Type |
Solder Paste |
Shipping Info |
- |
Shelf Life Start |
Date of Manufacture |
Shelf Life |
12 Months |
Series |
- |
Process |
Lead Free |
Moisture Sensitivity Level (MSL) |
Not Applicable |
Melting Point |
423 ~ 428°F (217 ~ 220°C) |
Manufacturer Standard Lead Time |
3 Weeks |
Lead Free Status / RoHS Status |
Lead free / RoHS Compliant |
Form |
Jar, 8.8 oz (250g) |
Flux Type |
No-Clean |
Diameter |
- |
Detailed Description |
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g) |
Composition |
Sn96.5Ag3Cu0.5 (96.5/3/0.5) |